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March 27, 2025

Nanostructured copper alloy rivals superalloys in strength and stability

Colorized scanning transmission electron microscope (STEM) image showing a Cu3Li precipitate in the Cu-Ta-Li alloy. The orange-colored features are primarily Cu atoms in the alloy matrix, while the blue and yellow features correspond to the Cu3Li precipitate. The yellow represents Ta atoms in the atomic bilayer complexion, and the blue features represent Li atoms in the core of the Cu3Li precipitate. Credit: Lehigh University
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Colorized scanning transmission electron microscope (STEM) image showing a Cu3Li precipitate in the Cu-Ta-Li alloy. The orange-colored features are primarily Cu atoms in the alloy matrix, while the blue and yellow features correspond to the Cu3Li precipitate. The yellow represents Ta atoms in the atomic bilayer complexion, and the blue features represent Li atoms in the core of the Cu3Li precipitate. Credit: Lehigh University

Researchers from the U.S. Army Research Laboratory (ARL) and Lehigh University have developed a nanostructured copper alloy that could redefine high-temperature materials for aerospace, defense, and industrial applications.

Their findings, in the journal Science, introduce a Cu-Ta-Li (copper-tantalum-lithium) alloy with exceptional thermal stability and , making it one of the most resilient copper-based materials ever created.

"This is cutting-edge science, developing a new material that uniquely combines copper's excellent conductivity with strength and durability on the scale of nickel-based superalloys," said Martin Harmer, the Alcoa Foundation Professor Emeritus of Materials Science and Engineering at Lehigh University and a co-author of the study. "It provides industry and the military with the foundation to create new materials for hypersonics and high-performance turbine engines."

The ARL and Lehigh researchers collaborated with scientists from Arizona State University and Louisiana State University to develop the alloy, which can withstand extreme heat without significant degradation.

Combining copper with a complexion-stabilized nanostructure

The breakthrough comes from the formation of Cu3Li precipitates, stabilized by a Ta-rich atomic bilayer complexion, a concept the . Unlike typical grain boundaries that migrate over time at , this complexion acts as a structural stabilizer, maintaining the nanocrystalline structure, preventing grain growth, and dramatically improving high-temperature performance.

The alloy holds its shape under extreme, long-term thermal exposure and , resisting deformation even near its , noted Patrick Cantwell, a research scientist at Lehigh University and co-author of the study.

By merging the high-temperature resilience of nickel-based superalloys with copper—which is known for exceptional conductivity—the material paves the way for next-generation applications, including heat exchangers, advanced propulsion systems, and thermal management solutions for cutting-edge missile and hypersonic technologies.

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A new class of high-performance materials

This new Cu-Ta-Li alloy offers a balance of properties not found in existing materials:

How the researchers made and tested it

The team synthesized the alloy using powder metallurgy and high-energy cryogenic milling, ensuring a fine-scale nanostructure. They then subjected it to:

The U.S. Army Research Laboratory was awarded a U.S. patent (US 11,975,385 B2) for the alloy, highlighting its strategic significance, particularly in defense applications like military , propulsion systems, and hypersonic vehicles.

The scientists say further research will include direct measurements of the alloy's thermal conductivity compared to nickel-based alternatives, work to ready it for potential applications, and the development of other high-temperature alloys following a similar design strategy.

"This project is a great example of how federal investment in fundamental science drives American leadership in materials technology," Harmer said. "Scientific discoveries such as this are key to strengthening national security and fueling industrial innovation."

More information: B. C. Hornbuckle et al, A high-temperature nanostructured Cu-Ta-Li alloy with complexion-stabilized precipitates, Science (2025). .

Journal information: Science

Provided by Lehigh University

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Get Instant Summarized Text (GIST)

A nanostructured copper-tantalum-lithium alloy has been developed, exhibiting exceptional thermal stability and mechanical strength, rivaling nickel-based superalloys. The alloy's unique structure, featuring Cu3Li precipitates stabilized by a Ta-rich atomic bilayer, maintains its integrity under extreme heat and stress. This innovation combines copper's conductivity with superalloy-like resilience, offering potential for advanced aerospace and defense applications.

This summary was automatically generated using LLM.