(Â鶹ÒùÔºOrg.com) -- Move over silicon. There's a new electronic material in town, and it goes fast. That material, the focus of the 2010 Nobel Prize in physics, is graphene -- a fancy name for extremely thin layers of ordinary ...
Nanotechnologists at The University of Texas at Dallas have invented a broadly deployable technology for producing weavable, knittable, sewable, and knottable yarns containing up to 95 weight percent of otherwise unspinnable ...
A research group at the Japan's National Institute for Materials Science have successfully developed a novel nanoferroelectric by a solution-based bottom-up nanotechnology.
The Global Crop Diversity Trust today announced a major global search to systematically find, gather, catalogue, use, and save the wild relatives of wheat, rice, beans, potato, barley, lentils, chickpea, and other essential ...
(Â鶹ÒùÔºOrg.com) -- In an experiment to collide lead nuclei together at CERN's Large Hadron Collider physicists from the ALICE detector team including researchers from the University of Birmingham have discovered that the very ...
(Â鶹ÒùÔºOrg.com) -- The venus flytrap plant captures its prey when it senses the presence of an insect on the tips of its leaves. An amphiphilic molecule designed by chemists at The City College of New York acts in a similar ...
If the UW Arboretum were just a pretty place to take a walk, its new Interactive Map wouldn't need much more than crisscrossing trails, grey blobs for parking lots and symbols marking the restrooms.
In 1881, a Spanish builder named Rafael Guastavino immigrated to the United States with no job, no family awaiting him and no grasp of English. He did possess one valuable piece of knowledge, however: Guastavino had learned ...
The story of the double helix's discovery has a few new twists. A new primary source -- a never-before-read stack of letters to and from Francis Crick, and other historical materials dating from the years 1950-76 -- has ...
University of Illinois engineers have developed a novel direct-writing method for manufacturing metal interconnects that could shrink integrated circuits and expand microelectronics.
